SMT Placement & Reflow

• Paste print with SPI control (if available)

• Place per CPL; verify polarity/orientation (diodes, IC pin‑1, electrolytics)

• Reflow per profile: preheat/soak, peak temp and time above liquidus per alloy datasheet

• BGA/QFN: sample X‑ray for voids/bridges

• Rework only with approval and per IPC‑7711/7721; document