Process Parameters

• Reflow (lead‑free, reference):

  • Preheat 120–170 °C / 60–120 s

  • Soak 150–180 °C / 60–120 s

  • Peak 235–250 °C / 10–40 s above liquidus

  • Record actual values per alloy/parts

• Selective/wave:

  • Preheat per machine

  • Solder temp ~260 ± 5 °C

  • Contact time 2–4 s (layout/part dependent)

• ESD environment:

  • 40–60 % RH

  • 20–26 °C

  • Grounding resistance < 1 GΩ

  • test wrist straps daily

• AQL (if applied):

  • Critical 0.65

  • Major 1.0

  • Minor 2.5 (define per project)