Build Preparation

• Verify stencil (thickness, apertures)

• Solder paste type (e.g., SAC305 lead‑free), shelf life/conditioning

• Line setup: feeders to positions; cross‑check MPN ↔ BOM/CPL (four‑eyes principle)

• First article run (1–5 boards) to optimize paste/placement/reflow profile (record & archive)

• Enable labeling (SN/QR) and traceability