Requirements

Released inputs from Engineering:

• Gerber/ODB++/drill data, stack‑up, impedance targets

• Schematic (PDF), BOM (with manufacturer MPN & approved alternates), CPL/XY

• Assembly drawings (top/bottom, polarities, special notes)

• Test instruction (ICT/FCT), limits, fixture data

• Programming package (HEX/BIN/ELF, offsets, fuses, bootloader, SN/calibration rules)

• Labeling/marking data (SN, Data‑Matrix/QR)

Equipment/Software:

• Stencil printer + stencil, SMT pick‑and‑place, reflow oven

• Selective/wave soldering (for THT)

• AOI/microscope, X‑ray for BGA as needed

• ICT/Flying Probe or bed‑of‑nails fixture, bench PSU with current limit, DMM, oscilloscope

• Programmer (e.g., J‑Link, ST‑LINK, AVR‑ISP, PICkit, etc.)

• ERP/MES/traceability system