SMT Placement & Reflow
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	* Paste print with SPI control (if available)
	* Place per CPL; verify polarity/orientation (diodes, IC pin‑1, electrolytics)
	* Reflow per profile: preheat/soak, peak temp and time above liquidus per alloy datasheet
	* BGA/QFN: sample X‑ray for voids/bridges
	* Rework only with approval and per IPC‑7711/7721; document